Featured Products
> Cu-Interposer
> Glass-Circuit-Boards (GCB) – coming soon
> Antennas – coming soon
General properties
> patterned Wafer diameter from 2” up to 300 mm
> customized Redistribution Layers (RDL) up to 8″
> thickness from 200 µm to 1 mm
> wafers, panels or boards
> hole diameter from 100 µm (depending on wafer thickness)
> minimum pitch equal to via diameter
> Cu-layer thickness starting from 1 μm